Advanced Millimeter-wave Technologies: Antennas, Packaging by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

This booklet explains one of many most popular subject matters in instant and digital units group, specifically the instant verbal exchange at mmWave frequencies, in particular on the 60 GHz ISM band.  It offers the reader with wisdom and strategies for mmWave antenna layout, overview, antenna and chip packaging. Addresses useful engineering matters similar to RF fabric review and choice, antenna and packaging requisites, production tolerances, antenna and procedure interconnections, and antenna one of many first books to debate the rising study and alertness components, fairly chip applications with built-in antennas, wafer scale mmWave phased arrays and imaging includes a stable variety of case stories to assist realizing offers the antenna and packaging applied sciences for the newest and rising purposes with the emphases on antenna integrations for useful functions equivalent to instant USB, instant video, section array, motor vehicle collision avoidance radar, and imaging 

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4, respectively. The discussion includes chip-scale packaging, wafer-level assembly and low-cost plastic molding processes. Specifically, chip-on-board (COB) and no-lead packages such as quad flat-pack no-lead (QFN) packages are presented. 5 that is tailored to fast prototyping and quick turnaround times, making the design of emerging technologies more robust against process variation, material losses and assembly tolerances. 1 Definition of Packaging The packaging of electronic components is a multidisciplinary task involving various sciences and technologies.

1 Introduction Many of the millimeter-wave (mmWave) components which with we are familiar today, such as waveguides, horn antennas, polarizers, dielectric lenses and prisms, were already invented and used a hundred years ago. Hertz [5] demonstrated the generation of microwave frequencies in 1888 [1], some twenty years after James Clerk Maxwell published his equations predicting the existence of electromagnetic radiation propagating at the speed of light in 1865. Signaling experiments at mmWave frequencies were first carried out by J.

This discussion begins with critical issues that affect antennas, which are compounded at mmWave frequencies such as metallic and ohmic losses, spurious radiation and surface waves. The characterization of these effects in multilayer materials at mmWave frequencies is described and their impact on various antenna types and resulting performance is highlighted. This is used and applied to a number of antenna design examples from the most basic patch antenna to the more complex antenna arrays. This is then put in context by describing various packaging approaches and how one would create optimum feed networks for each.

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